It’s necessary to coolly analyze how Hanmi Semiconductor, which is regarded as a key driving force of AI infrastructure beyond just an equipment supplier, was able to establish such a strong position, and what growth engines it possesses for the future.

TC Bonder Technology: The ‘De Facto Standard’ Equipment in the HBM Market

The biggest reason Hanmi Semiconductor has emerged as a key player in the AI semiconductor era is its overwhelming TC bonder technology. A TC bonder is critical equipment in the HBM manufacturing process that precisely bonds DRAM chips at high temperatures and pressures. The precision and efficiency of this process determine the performance and yield of HBM. According to TechInsights, a global semiconductor market research firm, Hanmi Semiconductor firmly held the top position in the global HBM TC bonder market with an impressive 71.2% share as of Q3 2025.

• Hanmi Semiconductor entered the HBM equipment market in 2017 by launching the world’s first ‘TSV Dual Stacking TC Bonder’.
• It possesses all original TC bonder technologies for both NCF (Non-Conductive Film) type and MR-MUF (Mass Reflow-Molded Underfill) type, which are necessary for HBM manufacturing.
• It has established a mass production system for ‘TC Bonder 4’ for HBM4 starting July 2025, and plans to launch ‘Wide TC Bonder’ for next-generation HBM5 and HBM6 production in the second half of 2026.

Such unrivaled technological prowess and a proactive product development roadmap have made Hanmi Semiconductor the ‘de facto standard’ equipment supplier in the HBM market. Ultimately, as the number of HBM stacking layers increases, the importance of post-processing equipment, including TC bonders, can only grow.

Strengthening Global Market Dominance and Business Expansion Strategy

Hanmi Semiconductor is not merely staying in the domestic market but accelerating its expansion into the global market. In the past, it earned the nickname ‘Super Eul’ (a term for a strong supplier) through its close cooperation with SK Hynix, but now it is building an even more robust position by diversifying its customer base.

• It has expanded its customer portfolio by supplying TC bonder equipment to Micron in the United States.
• It plans to expand its market reach by supplying to foundries and OSAT (Outsourced Semiconductor Assembly and Test) companies in China and Taiwan.
• It is investing a total of 100 billion won to build a hybrid bonder factory with a total floor area of 4,415 pyeong (approx. 14,590 square meters) in Incheon, aiming for completion by the end of 2026. This is interpreted as a strategy to preempt the hybrid bonding market, a next-generation packaging technology.
• In September 2025, it established an AI Research Headquarters, integrating AI technology into TC bonder equipment to achieve process optimization, predictive analysis, and automation.

Such aggressive investment and technological convergence are important drivers that enable Hanmi Semiconductor to achieve continuous growth in the rapidly changing semiconductor market. Although competition from rivals is fierce, it is noteworthy that the company has built a strong defense with nearly 150 HBM equipment-related patents.

2026 Performance ‘Surge’ Forecast, What are the Future Growth Engines?

Hanmi Semiconductor recorded its highest-ever revenue in 2025, and is expected to break its own records again in 2026 and 2027. Forecasts even suggest that its estimated revenue for 2026 will be 1.0846 trillion won and operating profit 564.5 billion won, representing year-on-year growth of 64% and 52% respectively. These performance forecasts are acting as major factors in the ‘surge’ of Hanmi Semiconductor’s stock price in the market. Indeed, as of April 30, 2026, the stock price is soaring, having set a new 52-week high.

• The explosive growth of the AI semiconductor market and the expanded HBM investments by global semiconductor companies are driving Hanmi Semiconductor’s performance.
• The scheduled launch of new equipment for next-generation HBM4, HBM5, and HBM6 is expected to lead to continuous revenue growth.
• Chairman Kwak Dong-shin’s continuous share repurchases demonstrate the management’s commitment to responsible management and confidence in future growth, increasing market trust.

Ultimately, Hanmi Semiconductor is maintaining its technological superiority based on the clear growth engine of HBM, and is pursuing a strategy to preempt future markets through aggressive investment and business diversification. This is evidence that it is evolving beyond a mere semiconductor equipment company into a core infrastructure company for the AI era.

Hanmi Semiconductor reigns as an absolute powerhouse in the HBM market, fully benefiting from the AI semiconductor era. Its technological leadership, bold investments, and forward-looking strategy are unstoppable drivers of its growth. It is clear that Hanmi Semiconductor’s innovation and market dominance will continue in the future.

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2026, TSMC Performance Outlook is ‘Bright’

TSMC’s performance outlook for 2026 is truly beyond expectations. The company expects revenue to increase by nearly 30% in dollar terms in 2026. Wall Street analysts also anticipate at least 21% revenue growth, so wouldn’t you say this is practically a smooth road ahead? The compound annual growth rate from 2024 to 2029 is also expected to be around 25%, and it’s truly rare for a company of this size to maintain such a growth rate. This certainly shows its status as a key partner in the AI era.

2nm Mass Production and the Advent of A16 Process: Unrivaled Technological Leadership

TSMC isn’t called the ‘King of Technology’ for nothing. It has already begun mass production of its 2-nanometer (nm) process, firmly establishing its unrivaled technological leadership. Renowned big tech companies like Nvidia, AMD, Qualcomm, and Apple have already pre-booked TSMC’s 2nm process capacity until 2028. Furthermore, in the second half of 2026, the 1.6nm-class A16 process is scheduled to enter production, and this technology will incorporate an innovative power delivery method called ‘Super Power Rail,’ making it truly the ultimate in technology. Looking at the Q4 results from last year alone, the revenue share from sub-7nm advanced processes reached 74%, so its technological prowess is truly undeniable.

The Game Changer in the Foundry 2.0 Era: Advanced Packaging

These days, the term ‘Foundry 2.0’ is frequently heard in the semiconductor industry, which refers to a platform business that provides integrated services from design to advanced packaging and software ecosystems, beyond simple chip production. TSMC boasts an overwhelming market share in this Foundry 2.0 market as well. As of last year, TSMC’s market share in Foundry 2.0 was 38%, while Samsung Electronics was at around 4%, indicating a significant gap. In particular, advanced packaging technologies like CoWoS are considered TSMC’s core competitiveness, and the company plans to increase its advanced packaging equipment by a whopping 80% in 2026. Since performance and power efficiency are crucial for AI semiconductors, and packaging technology is a key factor determining these, it’s a natural progression for TSMC to focus on this area.

Global Production Base Expansion and Geopolitical Risks

TSMC is actively expanding its overseas production bases due to various factors such as geopolitical risks in Taiwan and the US policy of domestic semiconductor production. In Arizona, USA, a factory for 2nm process is already under construction, and even the 4th factory, targeting mass production in 2030, is already fully booked. In Kumamoto, Japan, a second factory is being built to operate a 3nm process and produce AI chips by the end of next year, clearly showing its efforts to stabilize the global supply chain. Of course, there are risks such as energy issues and high overseas production costs, but TSMC is overcoming these challenges and moving forward.
TSMC’s 2026 will truly be a year of further solidifying its technological innovation and market dominance. I believe that as the AI era fully takes off, TSMC’s presence will become even greater.

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