It’s necessary to coolly analyze how Hanmi Semiconductor, which is regarded as a key driving force of AI infrastructure beyond just an equipment supplier, was able to establish such a strong position, and what growth engines it possesses for the future.

TC Bonder Technology: The ‘De Facto Standard’ Equipment in the HBM Market

The biggest reason Hanmi Semiconductor has emerged as a key player in the AI semiconductor era is its overwhelming TC bonder technology. A TC bonder is critical equipment in the HBM manufacturing process that precisely bonds DRAM chips at high temperatures and pressures. The precision and efficiency of this process determine the performance and yield of HBM. According to TechInsights, a global semiconductor market research firm, Hanmi Semiconductor firmly held the top position in the global HBM TC bonder market with an impressive 71.2% share as of Q3 2025.

• Hanmi Semiconductor entered the HBM equipment market in 2017 by launching the world’s first ‘TSV Dual Stacking TC Bonder’.
• It possesses all original TC bonder technologies for both NCF (Non-Conductive Film) type and MR-MUF (Mass Reflow-Molded Underfill) type, which are necessary for HBM manufacturing.
• It has established a mass production system for ‘TC Bonder 4’ for HBM4 starting July 2025, and plans to launch ‘Wide TC Bonder’ for next-generation HBM5 and HBM6 production in the second half of 2026.

Such unrivaled technological prowess and a proactive product development roadmap have made Hanmi Semiconductor the ‘de facto standard’ equipment supplier in the HBM market. Ultimately, as the number of HBM stacking layers increases, the importance of post-processing equipment, including TC bonders, can only grow.

Strengthening Global Market Dominance and Business Expansion Strategy

Hanmi Semiconductor is not merely staying in the domestic market but accelerating its expansion into the global market. In the past, it earned the nickname ‘Super Eul’ (a term for a strong supplier) through its close cooperation with SK Hynix, but now it is building an even more robust position by diversifying its customer base.

• It has expanded its customer portfolio by supplying TC bonder equipment to Micron in the United States.
• It plans to expand its market reach by supplying to foundries and OSAT (Outsourced Semiconductor Assembly and Test) companies in China and Taiwan.
• It is investing a total of 100 billion won to build a hybrid bonder factory with a total floor area of 4,415 pyeong (approx. 14,590 square meters) in Incheon, aiming for completion by the end of 2026. This is interpreted as a strategy to preempt the hybrid bonding market, a next-generation packaging technology.
• In September 2025, it established an AI Research Headquarters, integrating AI technology into TC bonder equipment to achieve process optimization, predictive analysis, and automation.

Such aggressive investment and technological convergence are important drivers that enable Hanmi Semiconductor to achieve continuous growth in the rapidly changing semiconductor market. Although competition from rivals is fierce, it is noteworthy that the company has built a strong defense with nearly 150 HBM equipment-related patents.

2026 Performance ‘Surge’ Forecast, What are the Future Growth Engines?

Hanmi Semiconductor recorded its highest-ever revenue in 2025, and is expected to break its own records again in 2026 and 2027. Forecasts even suggest that its estimated revenue for 2026 will be 1.0846 trillion won and operating profit 564.5 billion won, representing year-on-year growth of 64% and 52% respectively. These performance forecasts are acting as major factors in the ‘surge’ of Hanmi Semiconductor’s stock price in the market. Indeed, as of April 30, 2026, the stock price is soaring, having set a new 52-week high.

• The explosive growth of the AI semiconductor market and the expanded HBM investments by global semiconductor companies are driving Hanmi Semiconductor’s performance.
• The scheduled launch of new equipment for next-generation HBM4, HBM5, and HBM6 is expected to lead to continuous revenue growth.
• Chairman Kwak Dong-shin’s continuous share repurchases demonstrate the management’s commitment to responsible management and confidence in future growth, increasing market trust.

Ultimately, Hanmi Semiconductor is maintaining its technological superiority based on the clear growth engine of HBM, and is pursuing a strategy to preempt future markets through aggressive investment and business diversification. This is evidence that it is evolving beyond a mere semiconductor equipment company into a core infrastructure company for the AI era.

Hanmi Semiconductor reigns as an absolute powerhouse in the HBM market, fully benefiting from the AI semiconductor era. Its technological leadership, bold investments, and forward-looking strategy are unstoppable drivers of its growth. It is clear that Hanmi Semiconductor’s innovation and market dominance will continue in the future.

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