Tag: Post-processing Equipment
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Hanmi Semiconductor Dominates HBM TC Bonder Market with 71% Share, The Real Reason for a ‘Quantum Leap’ in 2026
The advent of the Artificial Intelligence (AI) era has completely reshaped the landscape of the semiconductor industry. High Bandwidth Memory (HBM), in particular, has become a core component of AI semiconductors, and one company stands out in the TC bonder market, an essential equipment for producing HBM. That company is Hanmi Semiconductor. Having achieved phenomenal…